This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: Innovations by Keith A. Synder
Introduction
Keith A. Synder is an accomplished inventor based in Vestal, NY (US). He is known for his innovative contributions to electronic packaging technology. With a focus on improving heat dissipation and assembly processes, his work has significant implications for the electronics industry.
Latest Patents
One of Keith A. Synder's notable patents is for an electronic package that features a device positioned above a substrate by suction. This invention includes a first circuitized substrate, a second flexible circuitized substrate, an electronic device, and a metallic heat sink member. The design allows for a predetermined quantity of liquid material to create a suction force, elevating the device above the first circuitized substrate during assembly. This innovative approach enhances heat dissipation and simplifies the assembly process.
Career Highlights
Keith A. Synder is associated with the International Business Machines Corporation (IBM), where he has made significant contributions to the field of electronics. His work has been instrumental in advancing the technology used in electronic packaging, showcasing his expertise and commitment to innovation.
Collaborations
Throughout his career, Keith has collaborated with various professionals, including his coworker Alan L. Jones. These collaborations have fostered an environment of creativity and innovation, leading to advancements in electronic packaging technologies.
Conclusion
Keith A. Synder's contributions to electronic packaging technology exemplify the spirit of innovation. His patent for an electronic package with a suction-based device positioning demonstrates his commitment to improving efficiency and performance in the electronics industry.