Keita Miyazato

Title: Keita Miyazato: Innovator in Printed Circuit Board Technology

Introduction

Keita Miyazato is a prominent inventor based in Fukushima, Japan. He has made significant contributions to the field of printed circuit board technology, holding a total of 4 patents. His innovative work focuses on improving the materials and processes used in the production of substrates for printed circuit boards.

Latest Patents

Miyazato's latest patents include a substrate for printed circuit boards using photocurable resin. This invention outlines a process for producing a substrate that involves a vessel for containing a photo-curable resin, a masking means positioned above the resin surface, and a planar light for irradiating the resin. The process allows for the successive coating and formation of additional thin layers of cured products. Another notable patent is for an agent that improves composite materials. This novel silane coupling agent is designed for the pretreatment of inorganic reinforcing materials, enhancing their compatibility with epoxy or polyimide resins. The resulting composite materials exhibit excellent heat resistance and stability.

Career Highlights

Throughout his career, Keita Miyazato has worked with notable companies such as Nitto Boseki Co., Ltd. and Shin-etsu Chemical Co., Ltd. His experience in these organizations has contributed to his expertise in material science and engineering.

Collaborations

Miyazato has collaborated with several professionals in his field, including Akinari Itagaki and Masaaki Yamaya. These collaborations have further enriched his research and development efforts.

Conclusion

Keita Miyazato is a distinguished inventor whose work in printed circuit board technology has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing material performance and production processes.