The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 1990
Filed:
Aug. 15, 1988
Akinari Itagaki, Gunma, JP;
Masaaki Yamaya, Gunma, JP;
Hiroshi Yoshioka, Tokyo, JP;
Akihiko Watanabe, Fukushima, JP;
Keita Miyazato, Fukushima, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Nitto Roseki Co., Ltd., Fukushima, JP;
Abstract
A novel silane coupling agent is proposed for the pretreatment of a glass fiber-based or mica flake-based inorganic reinforcing material prior to compounding with an epoxy resin or a polyimide resin as the matrix to give a composite material such as laminates having excellent heat resistance against molten solder alloy and resistance against heat shock. The principal ingredient of the treatment solution is a trialkoxysilylalkyl-substituted polymethylene diamine compound of the general formula (R.sup.1 O).sub.3 SiR.sup.2 NH(CH.sub.2).sub.n NHCH.sub.2 C.sub.6 H.sub.5, in which R.sup.1 is a methyl or ethyl group, R.sup.2 is a diavalent hydrocarbon group having 1 to 6 carbon atoms, e.g., methylene and propylene, and n is a integer of 4 to 8, or a hydrochloride thereof. This diamine compound is soluble in water, in particular, acidified with acetic acid and the aqueous solution is advantageouly stable in storage as compared with conventional silane coupling agents.