Company Filing History:
2 out of 266 
2 out of 5,978 
1 out of 1 Years Active: 1990-1992
Title: Akihiko Watanabe: Innovator in Printed-Wiring Board Technology
Introduction
Akihiko Watanabe is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of printed-wiring board technology, holding a total of 3 patents. His innovative work focuses on improving the manufacturing processes and materials used in electronic components.
Latest Patents
Watanabe's latest patents include a transfer sheet for making printed-wiring boards by injection molding. This invention is designed to prevent circuit damage during the injection molding process while ensuring excellent releasability. The transfer sheet comprises a carrier film, a copper foil circuit, and a releasing layer positioned between the carrier film and the copper foil circuit. The releasing layer is engineered to have a T-type peeling strength between 0.025-0.25 kg/25 mm. Additionally, he has developed a novel silane coupling agent aimed at enhancing composite materials. This agent is particularly effective for the pretreatment of glass fiber-based or mica flake-based inorganic reinforcing materials before compounding with epoxy or polyimide resins. The principal ingredient of this treatment solution is a trialkoxysilylalkyl-substituted polymethylene diamine compound, which is stable in storage compared to conventional silane coupling agents.
Career Highlights
Throughout his career, Watanabe has worked with prominent companies such as Nitto Boseki Co., Ltd. and Shin-Etsu Chemical Co., Ltd. His experience in these organizations has allowed him to refine his expertise in materials science and engineering.
Collaborations
Watanabe has collaborated with notable coworkers, including Akinari Itagaki and Masaaki Yamaya. Their combined efforts have contributed to advancements in the field of electronic materials and manufacturing processes.
Conclusion
Akihiko Watanabe's innovative contributions to printed-wiring board technology and composite materials demonstrate his commitment to advancing the field. His patents reflect a deep understanding of materials and processes that enhance the performance and reliability of electronic components.