Keita Arakawa

Title: Keita Arakawa: Innovator in Polishing Technology

Introduction

Keita Arakawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of polishing technology, holding two patents that showcase his innovative approach to creating effective polishing liquids.

Latest Patents

Arakawa's latest patents include a slurry, polishing-liquid set, polishing liquid, and a polishing method for substrates. The first patent describes a polishing liquid that comprises abrasive grains, a compound with an aromatic heterocycle, an additive, and water. The abrasive grains include a hydroxide of a tetravalent metal element, while the aromatic heterocycle features an endocyclic nitrogen atom not bound to a hydrogen atom. The charge of this nitrogen atom, determined using the Merz-Kollman method, is -0.45 or less. The second patent similarly outlines a polishing liquid with the same components and specifications, emphasizing the innovative nature of his work in this area.

Career Highlights

Throughout his career, Keita Arakawa has worked with prominent companies such as Hitachi Chemical Company, Ltd. and Showa Denko Materials Co., Ltd. His experience in these organizations has allowed him to refine his expertise in polishing technologies and contribute to advancements in the field.

Collaborations

Arakawa has collaborated with notable coworkers, including Hisataka Minami and Tomohiro Iwano. Their joint efforts have likely played a role in the development of his innovative patents.

Conclusion

Keita Arakawa's contributions to polishing technology through his patents reflect his dedication to innovation in the field. His work continues to influence advancements in polishing methods and materials.