Keisuke Honda

Title: Keisuke Honda: Innovator in Electroplating Technology

Introduction

Keisuke Honda is a notable inventor hailing from Shimizu, Japan. He has made significant contributions to the field of electroplating technology, particularly with his innovative patent that addresses current leakage during the electroplating process. His work has implications for the production of metal foils and printed circuit patterns, showcasing his expertise in this specialized area.

Latest Patents

Keisuke Honda holds a patent for an "Apparatus for electroplating strip material without current leakage." This invention involves a system designed for the production of metal foil or printed circuit patterns on a continuously advancing strip of electrically conductive material. The apparatus includes a cathode that the conductive strip slides against, an insoluble anode positioned beneath the cathode, and a solution inlet block that feeds the electroplating solution into the interelectrode gap. This innovative design helps prevent premature metal deposition and the development of pinholes in the final product.

Career Highlights

Honda is associated with Koito Seisakusho Co., Ltd., where he has applied his skills and knowledge to advance electroplating technologies. His work has been instrumental in improving manufacturing processes and ensuring high-quality outputs in the production of electronic components.

Collaborations

Throughout his career, Keisuke Honda has collaborated with notable colleagues, including Glenn R. Schaer and Tasuku Touyama. These partnerships have contributed to the development and refinement of his innovative technologies.

Conclusion

Keisuke Honda's contributions to electroplating technology exemplify the impact of innovation in manufacturing processes. His patent addresses critical challenges in the industry, showcasing his role as a forward-thinking inventor.