Otake, Japan

Keiko Yasukawa

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Rayon Company, Limited. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiko Yasukawa. Retrieved from https://idiyas.com/inventor/keiko-yasukawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Keiko Yasukawa: Innovator in Resin Composition Technology

Introduction

Keiko Yasukawa is a prominent inventor based in Otake, Japan. She has made significant contributions to the field of resin compositions, particularly in developing materials with enhanced properties. Her work focuses on creating articles that exhibit high scratch resistance and satisfactory fingerprint wipeability.

Latest Patents

Yasukawa holds a patent for an article and active energy ray-curable resin composition. This invention provides a microrelief structure containing a cured product of a resin composition on the surface. The cured product's indentation elastic modulus and creep deformation ratio meet specific criteria, ensuring durability and functionality.

Career Highlights

Keiko Yasukawa is associated with Mitsubishi Rayon Company, Limited, where she has been instrumental in advancing resin technology. Her innovative approach has led to the development of products that meet the demands of modern applications.

Collaborations

Yasukawa collaborates with talented colleagues, including Go Otani and Seiichiro Mori. These partnerships enhance her research and development efforts, contributing to the success of her projects.

Conclusion

Keiko Yasukawa's work in resin composition technology exemplifies innovation and dedication. Her contributions continue to impact the industry positively, showcasing the importance of research and development in creating advanced materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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