The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Jun. 17, 2013
Applicant:
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Inventors:
Go Otani, Otake, JP;
Seiichiro Mori, Toyohashi, JP;
Masashi Ikawa, Otake, JP;
Yusuke Nakai, Otake, JP;
Keiko Yasukawa, Otake, JP;
Shinji Makino, Otake, JP;
Assignee:
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 222/10 (2006.01); C08F 222/20 (2006.01); C08F 290/06 (2006.01); C08F 299/02 (2006.01); G02B 1/11 (2015.01); B29C 37/00 (2006.01); B29C 59/04 (2006.01); G02B 1/118 (2015.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
C08F 222/1006 (2013.01); C08F 222/20 (2013.01); C08F 290/062 (2013.01); C08F 299/02 (2013.01); G02B 1/11 (2013.01); G02B 1/118 (2013.01); B29C 37/0067 (2013.01); B29C 59/046 (2013.01); B29C 2035/0827 (2013.01);
Abstract
Provided is an article having high scratch resistance and satisfactory fingerprint wipeability. Disclosed is an article having a microrelief structure containing a cured product of a resin composition on the surface, in which the indentation elastic modulus (X) [MPa] and the creep deformation ratio (Y) [%] of the cured product satisfy the following formulas (1) and (2):80≦≦560  (1)≦(0.00022−0.01)×100  (2).