Kameyama, Japan

Keiji Wada

This inventor holds 1 USPTO granted patent. Top assignee: Honda Giken Kogyo Kabushiki Kaisha. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiji Wada. Retrieved from https://idiyas.com/inventor/keiji-wada-r949zh9a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Keiji Wada and His Shell Molding Apparatus Patent

Introduction

Keiji Wada is an inventor associated with Kameyama, Japan, and Honda Giken Kogyo Kabushiki Kaisha, commonly known as Honda Motor Co., Ltd. His patent work includes an invention designed to improve the operation of shell molding equipment.

Latest Patents

Wada is credited with 1 patent, titled “Shell Molding Apparatus.” The apparatus uses upper and lower dies to form shell molds. Its lower die contains multiple shell-molding inserts, retractable spiny inserts with protrusions, and mechanisms that control the inserts and their withdrawal pins.

The design also includes features to manage thermal expansion and help prevent shell sand from collecting between the spiny inserts and their receiving recesses. These mechanisms are intended to support smooth insert movement during operation.

Career Highlights

Wada’s listed patent reflects work on specialized molding equipment and the mechanical challenges involved in controlling inserts, thermal expansion, and sand release. His association with Honda Giken Kogyo Kabushiki Kaisha connects his inventive work with a major Japanese manufacturing company.

Collaborations

The provided information lists Taiti Yoshikawa and Hiroshi Suzuki as Wada’s coworkers. It does not specify their roles in developing or patenting the shell molding apparatus.

Conclusion

Keiji Wada’s shell molding apparatus patent describes a coordinated system for shaping molds while addressing insert movement, thermal expansion, and sand release.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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