Nagaokakyo, Japan

Keiji Gemma

This inventor holds 1 USPTO granted patent. Top assignee: Omron Tateisi Electronics Co.. Active years: 1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiji Gemma. Retrieved from https://idiyas.com/inventor/keiji-gemma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: Keiji Gemma: Innovator in Electronic Component Assembly

Introduction

Keiji Gemma is a notable inventor based in Nagaokakyo, Japan. He has made significant contributions to the field of electronic component assembly, particularly with his innovative designs that enhance heat dissipation.

Latest Patents

One of his key patents is an electronic component assembly with direct mounting for proper heat dissipation. This assembly includes a body construction comprising a planar base portion, a fin projecting from the planar base portion, and a heat-generating element fixedly attached to the planar base portion. This design allows for excellent heat dissipation without the need for an intermediate heat dissipating plate.

Career Highlights

Keiji Gemma is associated with Omron Tateisi Electronics Co., where he has been instrumental in developing advanced electronic components. His work has been recognized for its practicality and efficiency in managing heat in electronic devices.

Collaborations

Throughout his career, Gemma has collaborated with talented individuals such as Hiroyuki Nishi and Makoto Watanabe, contributing to various projects that push the boundaries of electronic assembly technology.

Conclusion

Keiji Gemma's innovative approach to electronic component assembly has made a lasting impact in the industry. His patent for an efficient heat dissipation system exemplifies his commitment to advancing technology in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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