Kariya, Japan

Keiichi Kawata

This inventor holds 1 USPTO granted patent. Top assignees: Aichi-Prefectural Government, Nagoya Institute of Technology, Okuma Corporation. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiichi Kawata. Retrieved from https://idiyas.com/inventor/keiichi-kawata-kv3xrrl5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Keiichi Kawata: Innovator in Cutting Technology

Introduction

Keiichi Kawata is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of cutting technology, particularly through his innovative methods that enhance the efficiency and effectiveness of cutting processes.

Latest Patents

Kawata holds a patent for a cutting method that involves rotating a rotary tool with a circular cutting edge around an axis while supplying a cutting fluid. This method allows for cutting to be performed by a rotary tool that rotates in the same direction as the outflow of chips. The tool is designed to operate at a rotational speed that exceeds the outflow speed of the chips, thereby reducing direct solid contact between the tool and the chips. This dynamic pressure effect minimizes tool abrasion, leading to improved longevity and performance.

Career Highlights

Throughout his career, Keiichi Kawata has worked with prominent organizations such as Okuma Corporation and the Nagoya Institute of Technology. His experience in these institutions has allowed him to refine his skills and contribute to advancements in cutting technology.

Collaborations

Kawata has collaborated with notable colleagues, including Takashi Norihisa and Fumihiro Itoigawa. These partnerships have fostered innovation and the sharing of ideas within the field.

Conclusion

Keiichi Kawata's contributions to cutting technology through his patented methods demonstrate his commitment to innovation and excellence in engineering. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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