Chiba, Japan

Keiichi Itou

This inventor holds 1 USPTO granted patent. Top assignee: Subaru Corporation; Kinugawa Rubber Ind. Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiichi Itou. Retrieved from https://idiyas.com/inventor/keiichi-itou-keot28mu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Keiichi Itou and His Rubber Molded Body Patent

Introduction

Keiichi Itou is an inventor associated with Chiba, Japan. His listed patent concerns a rubber molded body made from a composition combining natural rubber, butadiene rubber, and low-melting additives.

Latest Patents

Itou is credited with 1 patent, titled “Rubber molded body.” The patent describes a rubber composition in which natural rubber and butadiene rubber are the predominant components, with their mass ratio ranging from 80/20 to 10/90. It also specifies low-melting paraffin wax with a melting point of 45°C to 57°C, and optionally low-melting fatty acid amide with a melting point of 35°C to 85°C. The composition contains 20 to 70 parts by mass of paraffin wax per 100 parts by mass of all rubber components. When fatty acid amide is included, the combined amount of wax and amide ranges from 30 to 100 parts by mass per 100 parts by mass of all rubber components.

Career Highlights

The supplied information associates Itou with Subaru Corporation and Kinugawa Rubber Ind. Co., Ltd. His patent focuses on the formulation of rubber materials for molded products.

Collaborations

The listed coworkers associated with Itou are Kazuhito Furuya and Yasushi Morita. Their names appear alongside his work on the rubber molded body invention.

Conclusion

Keiichi Itou’s recorded patent documents a rubber molded body composition with defined proportions of natural rubber, butadiene rubber, and low-melting additives.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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