Shizuoka, Japan

Keigo Tsubo

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Shizuoka, JP (2015 - 2021)
  • Makinohara, JP (2021)

Company Filing History:


Years Active: 2015-2021

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7 patents (USPTO):Explore Patents

Title: Keigo Tsubo: Innovator in Connector Technology

Introduction

Keigo Tsubo is a prominent inventor based in Shizuoka, Japan. He has made significant contributions to the field of connector technology, holding a total of 7 patents. His innovative designs have enhanced the functionality and efficiency of various electronic components.

Latest Patents

Among his latest patents, Tsubo has developed a connector structure that includes both a female and male housing. The female housing features a first holding portion for power supply terminals and a second holding portion for communication terminals, separated by a conductive shield layer. The male housing is designed to fit seamlessly with the female housing, ensuring reliable connections for both power and communication. Another notable patent is a noise filter that incorporates a filter circuit with a noise reduction element. This design effectively reduces noise components in electrical connections, enhancing overall performance.

Career Highlights

Keigo Tsubo is currently employed at Yazaki Corporation, a leading company in the automotive and electronic components industry. His work has been instrumental in advancing connector technology, making significant impacts on product reliability and performance.

Collaborations

Throughout his career, Tsubo has collaborated with talented coworkers, including Keiji Hamada and Takumi Nakagishi. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Keigo Tsubo's contributions to connector technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of electrical engineering and a commitment to improving electronic connectivity.

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