Itano-gun, Japan

Kei Ueta

This inventor holds 1 USPTO granted patent. Top assignee: Shikoku Kakoki Co., Ltd.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kei Ueta. Retrieved from https://idiyas.com/inventor/kei-ueta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Kei Ueta - Innovator in Packaging Technology

Introduction

Kei Ueta is a notable inventor based in Itano-gun, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance efficiency and functionality in packaging machines.

Latest Patents

Ueta holds a patent for an "Ear bonding device for use in packaging machines." This device features a container transport conveyor equipped with multiple holders designed to support containers with upper and lower ears. The conveyor operates intermittently, allowing containers to halt at a pressure-bonding station. The design includes an upper ear pressing member that moves vertically and a pair of lower ear pressing members that can adjust their positions. This innovative mechanism ensures effective pressure bonding of the containers.

Career Highlights

Kei Ueta is associated with Shikoku Kakoki Co., Ltd., where he has been instrumental in developing advanced packaging solutions. His work has contributed to the company's reputation for innovation in the packaging industry.

Collaborations

Ueta collaborates with talented individuals such as Michio Ueda and Kiyomi Yoshida, who share his commitment to advancing packaging technology.

Conclusion

Kei Ueta's contributions to packaging technology through his innovative ear bonding device exemplify his dedication to improving industrial processes. His work continues to influence the packaging industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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