Tokyo, Japan

Kei Ichikawa


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Kei Ichikawa: Innovator in Vehicle Body Structures

Introduction

Kei Ichikawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the automotive industry, particularly in the design and structure of vehicle bodies. His innovative approach has led to the development of a unique patent that enhances vehicle safety and performance.

Latest Patents

Ichikawa holds a patent for a "Vehicle body rear part structure." This invention provides a comprehensive design that includes a load support part on a quarter pillar. The structure features a side sill stiffener, a quarter pillar stiffener, and a damper stiffener. The side sill stiffener reinforces the side sill and forms part of the quarter pillar, while the quarter pillar stiffener is continuously provided with the side sill stiffener to enhance the quarter pillar's strength. Additionally, the damper stiffener is positioned above the rear wheel house and is joined to both the quarter pillar stiffener and the roof side rail. This innovative design aims to improve the overall structural integrity of vehicles.

Career Highlights

Kei Ichikawa is currently employed at Honda Motor Co., Ltd., where he continues to work on advancing automotive technologies. His expertise in vehicle body structures has positioned him as a valuable asset within the company.

Collaborations

Ichikawa collaborates with talented colleagues, including Masahiro Kawazu and Hiroyuki Yasuda. Together, they contribute to the innovative projects at Honda, pushing the boundaries of automotive design.

Conclusion

Kei Ichikawa's work exemplifies the spirit of innovation in the automotive industry. His patent for the vehicle body rear part structure showcases his commitment to enhancing vehicle safety and performance. Through his contributions, Ichikawa continues to influence the future of automotive engineering.

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