This inventor holds 1 USPTO granted patent. Top assignee: Spansion LLC.. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Kee Cheng Sim: Innovator in Die Attach Film Technology
Introduction
Kee Cheng Sim is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging through his innovative patent. His work focuses on improving the efficiency and effectiveness of die attach processes.
Latest Patents
Kee Cheng Sim holds a patent titled "Process applying die attach film to singulated die." This patent describes methods and systems for applying a plurality of pieces of die attach film to a plurality of singulated dice. The method involves creating intervals between rows and columns of die attach film pieces, which can be achieved by expanding an underlaid expandable film or by removing portions of the die attach film. This innovative approach enhances the placement of singulated dice back side down on the die attach film.
Career Highlights
Kee Cheng Sim is currently employed at Spansion LLC, a company known for its advancements in semiconductor technology. His work at Spansion has allowed him to further develop his expertise in die attach processes and contribute to the company's innovative projects.
Collaborations
Kee Cheng Sim collaborates with talented coworkers, including Tan Kiah Ling and Sally Foong. Their teamwork fosters a creative environment that encourages innovation and the development of new technologies.
Conclusion
Kee Cheng Sim's contributions to the field of semiconductor packaging through his patent demonstrate his commitment to innovation. His work continues to influence the industry and improve manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile