Company Filing History:
Years Active: 2017-2023
Title: Kedar Dhane: Innovator in Electronic Packaging
Introduction
Kedar Dhane is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of 5 patents. His innovative work focuses on improving thermal management in electronic devices, which is crucial for enhancing performance and reliability.
Latest Patents
One of Kedar's latest patents is for a liquid thermal interface material in electronic packaging. This invention describes an integrated circuit package that includes a liquid phase thermal interface material (TIM). The package can accommodate multiple die, and the liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader. This design addresses failure mechanisms present in solid phase TIMs, such as cracking due to warpage. The thermal conductivity of the liquid phase TIM can reach at least 15 Watts/meter-Kelvin, making it a highly effective solution for thermal management.
Another notable patent involves an electronic package that includes multiple supports. This design features a substrate with a die attached, and an underfill positioned between the die and the substrate due to capillary action. The package includes a first support adjacent to the die and a second support mounted on the first support. This innovative structure enhances the stability and performance of the electronic package.
Career Highlights
Kedar Dhane is currently employed at Intel Corporation, where he continues to push the boundaries of electronic packaging technology. His work has been instrumental in developing solutions that improve the efficiency and reliability of electronic devices.
Collaborations
Kedar collaborates with talented coworkers such as Omkar G Karhade and Mingjie Xu. Their combined expertise contributes to the innovative projects at Intel Corporation.
Conclusion
Kedar Dhane is a key figure in the field of electronic packaging, with a focus on thermal management solutions. His patents reflect a commitment to innovation and excellence in technology.