This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Keck Tim Ang: Semiconductor Packaging Inventor
Introduction
Keck Tim Ang is an inventor based in Malacca, Malaysia, associated with Infineon Technologies AG. His patent work includes a semiconductor packaging method that uses metal posts formed from a structured leadframe.
Latest Patents
The provided information lists 1 patent for Ang: “Semiconductor Package with Metal Posts from Structured Leadframe.” The method begins with a metal baseplate comprising a planar base section and multiple posts extending upward from its surface. A semiconductor die is mounted on the baseplate, and an insulating mold compound forms the encapsulant body. The die’s terminals are electrically connected to the metal posts. Removing the base section then leaves the posts as package contacts at the encapsulant body’s surface.
Career Highlights
Ang’s listed patent focuses on a structured leadframe approach to semiconductor packaging. The described process integrates die mounting, electrical connections, encapsulation, and the formation of package contacts.
Collaborations
The provided information names Sock Chien Tey and Chan Lam Cha as Ang’s coworkers. It does not specify their roles in the patent or the invention.
Conclusion
Keck Tim Ang’s listed invention describes a semiconductor package that uses metal posts to form contacts after the base section is removed, highlighting his contribution to packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile