Aichi, Japan

Kazuyuki Maruyama

This inventor holds 1 USPTO granted patent. Top assignee: Ngk Spark Plug Company, Limited. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuyuki Maruyama. Retrieved from https://idiyas.com/inventor/kazuyuki-maruyama-14zvh140

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Kazuyuki Maruyama and Ceramic-Glass IC Package Technology.

Introduction

Kazuyuki Maruyama is an inventor associated with Aichi, Japan, and Ngk Spark Plug Company, Limited. His listed patent work concerns the design of ceramic-glass integrated circuit (IC) package assemblies.

Latest Patents

Maruyama is credited with 1 patent: “Ceramic-glass IC package assembly having multiple conductive layers.” The invention describes a laminated ceramic base containing two conductive layers between insulating ceramic layers. One layer serves as a power-source plane, connecting multiple IC-chip power terminals to a single power lead. The other serves as an earth plane, connecting multiple earth terminals to a single earth lead. This arrangement integrates power and earth connections within the package structure.

Career Highlights

The available information associates Maruyama’s patent activity with Ngk Spark Plug Company, Limited. His listed invention addresses electrical connections in ceramic IC packages through multiple conductive layers.

Collaborations

Maruyama’s listed coworker is Naomiki Kato. The available information identifies their professional association but does not specify the details of any joint work.

Conclusion

Kazuyuki Maruyama’s recorded patent contribution focuses on a multilayer ceramic-glass IC package that organizes power and earth connections within a compact assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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