Osaka, Japan

Kazuyuki Kitakura


Average Co-Inventor Count = 3.8

ph-index = 2

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 2000-2001

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Kazuyuki Kitakura

Introduction

Kazuyuki Kitakura, based in Osaka, Japan, is an accomplished inventor known for his significant contributions to the field of adhesive technologies. With a total of three patents to his name, he has focused on developing innovative materials that enhance performance in various applications, particularly in electronics.

Latest Patents

Kitakura's latest patents include a peelable heat-conductive and pressure-sensitive adhesive. This innovative adhesive comprises a polymer derived from a specific monomer mixture and is designed to exhibit tight adhesion during use while allowing for easy peeling afterward. The formulation incorporates a considerable amount of plasticizer and heat-conductive filler, making it suitable for high-performance applications. Additionally, his inventions include an adhesive sheet designed for fixing electronic parts to heat-radiating members, combining excellent heat conductivity with pressure sensitivity and high heat resistance.

Career Highlights

Kazuyuki Kitakura works at Nitto Denko Corporation, where he has played a crucial role in advancing adhesive technology. His work focuses on improving the efficiency and effectiveness of materials used in electronic components, contributing to the overall performance and reliability of electronic devices.

Collaborations

Throughout his career, Kitakura has collaborated with talented colleagues, including Masahiro Oura and Takao Yoshikawa. Together, they have worked on pioneering adhesive solutions that address the demands of modern technology, further establishing Nitto Denko Corporation as a leader in adhesive innovation.

Conclusion

Kazuyuki Kitakura's contributions to adhesive technology exemplify the spirit of innovation. His patents reflect a commitment to enhancing the performance of materials in critical applications, particularly in the electronics industry. Through collaboration and ingenuity, Kitakura continues to shape the future of adhesive solutions, paving the way for new advancements in the field.

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