Izumi, Japan

Kazuya Nagatomo

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Metals, Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuya Nagatomo. Retrieved from https://idiyas.com/inventor/kazuya-nagatomo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Kazuya Nagatomo: Innovator in Hermetic Sealing Technology

Introduction

Kazuya Nagatomo is a notable inventor based in Izumi, Japan. He has made significant contributions to the field of electronic component packaging through his innovative designs and patents. His work focuses on enhancing the reliability and performance of electronic devices.

Latest Patents

Kazuya Nagatomo holds a patent for a hermetic sealing cap, an electronic component housing package, and a method for manufacturing the hermetic sealing cap. This invention includes a base material with a first plated layer and a second plated layer formed on the first. The design features a surface sectioned into multiple regions, allowing for effective oxidation control in specific areas, which is crucial for maintaining the integrity of electronic components.

Career Highlights

Kazuya Nagatomo is currently employed at Hitachi Metals, Ltd., where he continues to develop innovative solutions in the field of electronics. His expertise in hermetic sealing technology has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Kazuya collaborates with Ken Asada, a fellow innovator, to further enhance their research and development efforts in electronic packaging technologies.

Conclusion

Kazuya Nagatomo's contributions to hermetic sealing technology exemplify the importance of innovation in the electronics industry. His patent and ongoing work at Hitachi Metals, Ltd. highlight his commitment to advancing technology for better electronic component reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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