Kariya, Japan

Kazutoshi Ito


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Kazutoshi Ito: Innovator in Heat Dissipation Technology

Introduction

Kazutoshi Ito is a notable inventor based in Kariya, Japan. He is recognized for his contributions to the field of heat dissipation technology, particularly in the design of structures that enhance the efficiency of electronic components. His innovative approach has led to the development of a patented solution that addresses critical challenges in thermal management.

Latest Patents

Kazutoshi Ito holds a patent for a heat dissipation structure. This invention includes a heat-producing electronic component mounted on a substrate, encased in a thermally conductive case. The design incorporates grease between the case and the electronic component or substrate, facilitating effective heat transfer. The case features contact surfaces that interact with the grease, which possess a free energy of 20 mN/m or higher and a roughness of 1.0 µm or greater. This innovative structure significantly improves the thermal management of electronic devices.

Career Highlights

Kazutoshi Ito is currently employed at Denso Corporation, a leading global automotive components manufacturer. His work at Denso has allowed him to focus on developing advanced technologies that enhance the performance and reliability of electronic systems in vehicles. His dedication to innovation has made a significant impact on the industry.

Collaborations

Throughout his career, Kazutoshi Ito has collaborated with talented colleagues, including Takamasa Oguri and Akihiro Mizutani. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Kazutoshi Ito's contributions to heat dissipation technology exemplify the importance of innovation in the electronics industry. His patented solutions not only enhance the performance of electronic components but also pave the way for future advancements in thermal management.

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