Kazutoshi Hohki

Title: Kazutoshi Hohki: Innovator in Multi-Chip Module Technology

Introduction

Kazutoshi Hohki is a notable inventor based in Hino, Japan. He has made significant contributions to the field of electronics, particularly in the development of multi-chip modules. With a total of 2 patents to his name, Hohki's work has had a considerable impact on the industry.

Latest Patents

Hohki's latest patents include a multi-chip module that features bare integrated circuit (IC) chips mounted on specific areas of a printed wiring board. This innovative design allows for outer electrode pads on the peripheries of the board to be soldered to another printed wiring board, such as a motherboard. The lead pads and outer electrode pads are interconnected through a circuit pattern, through holes, and interstitial via holes. Notably, the circuit pattern is disposed on a die bonding surface of the bare IC chips, where insulation is not necessary.

Career Highlights

Kazutoshi Hohki is currently employed at Kabushiki Kaisha Toshiba, a leading company in the electronics sector. His work at Toshiba has allowed him to explore and develop advanced technologies that enhance the performance and efficiency of electronic devices.

Collaborations

Hohki has collaborated with several talented individuals in his field, including Mitsutoshi Sawano and Masayoshi Yamaguchi. These collaborations have contributed to the successful development of innovative technologies and solutions.

Conclusion

Kazutoshi Hohki is a distinguished inventor whose work in multi-chip module technology has paved the way for advancements in electronics. His contributions continue to influence the industry, showcasing the importance of innovation in technology.