Tokyo, Japan

Kazuo Kitamura

This inventor holds 1 USPTO granted patent. Top assignee: Dai Nippon Printing Co., Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuo Kitamura. Retrieved from https://idiyas.com/inventor/kazuo-kitamura-ld0uwysu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 48(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Kazuo Kitamura: Innovator in Curved-Surface Transfer Technology

Introduction

Kazuo Kitamura is a notable inventor based in Shinjuku-Ku, Japan. He has made significant contributions to the field of printing technology, particularly through his innovative methods and apparatuses.

Latest Patents

Kazuo Kitamura holds a patent for a "Method and apparatus for curved-surface transfer." This invention showcases his expertise in enhancing printing techniques, allowing for more efficient and effective transfer processes on curved surfaces. He has 1 patent to his name.

Career Highlights

Kitamura is currently employed at Dai Nippon Printing Co., Ltd., a leading company in the printing industry. His work there has allowed him to develop and refine his innovative ideas, contributing to the company's reputation for excellence in printing technology.

Collaborations

Throughout his career, Kazuo Kitamura has collaborated with talented individuals such as Kazuhisa Kobayashi and Mitsutoyo Miyakoshi. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Kazuo Kitamura's contributions to curved-surface transfer technology highlight his innovative spirit and dedication to advancing the printing industry. His work continues to inspire future developments in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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