Kazumasa Asai

Title: Kazumasa Asai: Innovator in Polishing Technology

Introduction

Kazumasa Asai is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of polishing technology, particularly in methods that enhance the efficiency and effectiveness of wafer polishing. With a total of 5 patents to his name, Asai's work has had a considerable impact on the semiconductor industry.

Latest Patents

Asai's latest patents include a "Method for Conditioning Polishing Pad" and a "Double-Side Polishing Method." The first patent describes a method for conditioning a polishing pad attached to a rotatable discoid turntable. This method involves moving a conditioning head in a radial direction while controlling the rotational speed of the turntable and the moving speed of the conditioning head. This innovative approach allows for the effective conditioning of the entire polishing surface of the pad. The second patent outlines a double-side polishing method that polishes both surfaces of a wafer. This method utilizes a carrier with a holding hole and a ring-shaped resin insert, ensuring that the flatness and verticalness of the polished wafer are maintained within specified limits.

Career Highlights

Kazumasa Asai has worked with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor materials industry. His experience in this company has contributed to his expertise in polishing technologies and methods.

Collaborations

Asai has collaborated with notable coworkers such as Daisuke Furukawa and Takahiro Kida. Their combined efforts have further advanced the innovations in polishing technology.

Conclusion

Kazumasa Asai's contributions to polishing technology through his patents and collaborations highlight his role as a significant inventor in the semiconductor industry. His innovative methods continue to influence the efficiency of wafer polishing processes.