Company Filing History:
Years Active: 1998-2000
Title: Kazuko Nakamura: Innovator in Semiconductor Technology
Introduction
Kazuko Nakamura is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of semiconductor technology, particularly in wire bonding methods. With a total of 4 patents, her work has been instrumental in enhancing the reliability and quality of semiconductor devices.
Latest Patents
Nakamura's latest patents include innovative wire bonding apparatuses and methods. One notable patent describes a wire bonding method that utilizes a combination of load and supersonic wave vibration to join a metal wire with a bonding pad on a semiconductor element. This method involves applying a first bonding load and a second bonding load, which is lower than the first, during the interval from the contact of the metal wire to the application of the supersonic wave vibration. After the application of the vibration, a third bonding load, approximately 50% of the second bonding load, and a fourth bonding load, which is lower than the first but higher than the third, are continuously applied. This innovative approach significantly improves the reliability of fine wire bonding joints, allowing for the production of high-quality semiconductor devices at a lower cost.
Career Highlights
Throughout her career, Kazuko Nakamura has worked with notable companies such as Mitsubishi Electric Corporation and Nippon Thermostat Co., Ltd. Her experience in these organizations has contributed to her expertise in semiconductor technology and innovation.
Collaborations
Nakamura has collaborated with esteemed colleagues, including Hiroshi Horibe and Shinji Toyosaki. These partnerships have fostered a collaborative environment that has led to advancements in their respective fields.
Conclusion
Kazuko Nakamura's contributions to semiconductor technology through her innovative wire bonding methods have established her as a key figure in the industry. Her patents reflect her commitment to improving the quality and reliability of semiconductor devices.