Kawasaki, Japan

Kazuhisa Tsunoi

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 92(Granted Patents)


Location History:

  • Yokohama, JP (1987)
  • Kawasaki, JP (2001 - 2004)

Company Filing History:


Years Active: 1987-2004

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7 patents (USPTO):Explore Patents

Title: Kazuhisa Tsunoi: Innovator in Semiconductor Device Mounting

Introduction

Kazuhisa Tsunoi is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative approaches have enhanced the efficiency and reliability of semiconductor device mounting processes.

Latest Patents

Tsunoi's latest patents include a method for mounting semiconductor devices that utilize bumps on a board with pads. This method involves pressing the bumps onto the pads and applying heat to harden the adhesive between the semiconductor device and the board. Another notable patent describes a technique for mounting semiconductor chip parts on substrates, which ensures high efficiency and reliability. This method includes contact-bonding conductive wires to pads and using a flattening tool to achieve uniform bump heights before applying adhesive and heat.

Career Highlights

Kazuhisa Tsunoi is currently employed at Fujitsu Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the methods used in the industry today.

Collaborations

Throughout his career, Tsunoi has collaborated with notable colleagues, including Shunji Baba and Hidehiko Kira. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Kazuhisa Tsunoi's contributions to semiconductor device mounting have made a lasting impact on the industry. His innovative patents and collaborative efforts continue to drive advancements in technology.

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