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For the Inventor, By the Inventor

Kawasaki, Japan

Kazuhisa Tsunoi

This inventor holds 7 USPTO granted patents and 3 published patent applications. Top assignee: Fujitsu Corporation. Active years: 1987-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuhisa Tsunoi. Retrieved from https://idiyas.com/inventor/kazuhisa-tsunoi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 92(Granted Patents)


Location History:

  • Yokohama, JP (1987)
  • Kawasaki, JP (2001 - 2004)

Company Filing History:

goldMedal7 out of 39,387 
 
Fujitsu Corporation
 patents

Years Active: 1987-2004

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7 patents (USPTO):Explore Patents
1. 6787925 - Mounting method of semiconductor device (2004-09-07),
2. 6482676 - Method of mounting semiconductor chip part on substrate (2002-11-19),
3. 6458237 - Mounting method of semiconductor device (2002-10-01),
4. 6429516 - Structure for mounting a bare chip using an interposer (2002-08-06),
5. 6291269 - Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip (2001-09-18),
6. 6177730 - Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip (2001-01-23),
7. 4675789 - High density multilayer printed circuit board (1987-06-23),

Title: Kazuhisa Tsunoi: Innovator in Semiconductor Device Mounting

Introduction

Kazuhisa Tsunoi is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative approaches have enhanced the efficiency and reliability of semiconductor device mounting processes.

Latest Patents

Tsunoi's latest patents include a method for mounting semiconductor devices that utilize bumps on a board with pads. This method involves pressing the bumps onto the pads and applying heat to harden the adhesive between the semiconductor device and the board. Another notable patent describes a technique for mounting semiconductor chip parts on substrates, which ensures high efficiency and reliability. This method includes contact-bonding conductive wires to pads and using a flattening tool to achieve uniform bump heights before applying adhesive and heat.

Career Highlights

Kazuhisa Tsunoi is currently employed at Fujitsu Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the methods used in the industry today.

Collaborations

Throughout his career, Tsunoi has collaborated with notable colleagues, including Shunji Baba and Hidehiko Kira. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Kazuhisa Tsunoi's contributions to semiconductor device mounting have made a lasting impact on the industry. His innovative patents and collaborative efforts continue to drive advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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