The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Mar. 20, 1998
Kazuhisa Tsunoi, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Shunji Baba, Kawasaki, JP;
Akira Fujii, Kawasaki, JP;
Toshihiro Kusagaya, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Norio Kainuma, Kawasaki, JP;
Naoki Ishikawa, Kawasaki, JP;
Satoshi Emoto, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.