This inventor holds 4 USPTO granted patents. Top assignees: Asahi Denka Kogyo K.k., Asahi Denka Kogyo Kabushiki Kaisha. Active years: 1985-1999.
Location History:
- Kasukabe, JP (1985 - 1987)
- Tokyo, JP (1997 - 1999)
Company Filing History:
Years Active: 1985-1999
Title: Kazuhiro Urihara: Innovator in Urethane Modified Epoxy Resins
Introduction
Kazuhiro Urihara is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of urethane modified epoxy resins. With a total of four patents to his name, Urihara's work has had a substantial impact on adhesive technologies.
Latest Patents
Urihara's latest patents include innovative formulations of urethane modified epoxy resins. One of his patents describes a urethane modified epoxy resin obtained by the reaction of a preliminary condensate produced from an epoxy resin and a phosphorus compound acid, combined with an isocyanate group-terminated urethane prepolymer. This resin is particularly effective when used with an active organic hardening agent, resulting in an adhesive composition that excels in bonding iron and non-ferrous metals, especially in terms of shearing and peeling strength. Another patent focuses on a similar urethane modified epoxy resin derived from epoxy phosphate and isocyanate, further enhancing the adhesive properties for industrial applications.
Career Highlights
Throughout his career, Kazuhiro Urihara has worked with prominent companies such as Asahi Denka Kogyo Co., Ltd. His experience in these organizations has allowed him to refine his expertise in resin technology and adhesive applications.
Collaborations
Urihara has collaborated with notable colleagues, including Koji Akimoto and Hidehiko Kojo. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.
Conclusion
Kazuhiro Urihara's innovative work in urethane modified epoxy resins has positioned him as a key figure in adhesive technology. His patents reflect a commitment to enhancing the performance of bonding materials, making significant contributions to various industrial applications.