Ageo, Japan

Kazuhide Oshima


Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1999-2001

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3 patents (USPTO):Explore Patents

Title: Kazuhide Oshima: Innovator in Copper Foil Technology

Introduction

Kazuhide Oshima is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of copper foil technology, holding a total of 3 patents. His work primarily focuses on methods and apparatuses that enhance the efficiency and effectiveness of copper foil processing.

Latest Patents

One of Oshima's latest patents is a method of drying copper foil and a copper foil drying apparatus. This innovative method involves irradiating at least one surface-treated side of the copper foil with near-infrared rays to achieve effective drying. The apparatus designed for this method operates with low electric power while maintaining the drying temperature at 100°C or higher, facilitating the eutectic alloying of rust preventive metals with copper foil. Another significant patent is for an electrodeposited copper foil intended for printed wiring boards. This invention ensures that the original profile of the matte surface is completely removed, resulting in a surface with linear streaks and a roughness of 1.5 µm or less. The new surface undergoes a nodule forming treatment, enhancing its roughness to between 1.5 to 2.0 µm, which is crucial for creating fine circuit patterns.

Career Highlights

Kazuhide Oshima has worked with prominent companies such as Mitsui Mining & Smelting Company, Ltd. His experience in these organizations has allowed him to develop and refine his innovative techniques in copper foil technology.

Collaborations

Oshima has collaborated with notable coworkers, including Hideyasu Tagusari and Yutaka Hirasawa. Their combined expertise has contributed to the advancement of copper foil applications in various industries.

Conclusion

Kazuhide Oshima's contributions to copper foil technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the manufacturing processes of printed wiring boards and other applications.

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