Tokyo, Japan

Kazufumi Nomura


Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 35(Granted Patents)


Company Filing History:


Years Active: 2007-2008

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2 patents (USPTO):Explore Patents

Title: Kazufumi Nomura: Innovator in Electrolytic Processing Technology

Introduction

Kazufumi Nomura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electrolytic processing technology. With a total of 2 patents, his work focuses on enhancing the uniformity and efficiency of plating methods.

Latest Patents

Nomura's latest patents include an electrolytic processing apparatus and a substrate processing method. The electrolytic processing apparatus is designed to improve the in-plane uniformity of film thickness in plated films. It achieves this by creating a more uniform electric field distribution across large substrates. The apparatus features a substrate holder, first and second electrodes, a high resistance structure, and an electrolytic solution introducing portion. This innovative design allows for better control of the processing speed across the substrate's surface.

The plating method developed by Nomura is capable of depositing plated films with excellent in-plane uniformity. This method involves positioning an electric resistor between a conductive layer and an anode, while introducing plating and anode solutions to fill the space with a plating bath. The method ensures that the plated films exhibit superior embeddability in fine damascene structures.

Career Highlights

Kazufumi Nomura is associated with Ebara Corporation, where he continues to advance his research and development efforts. His work has been instrumental in improving the efficiency and effectiveness of electrolytic processing technologies.

Collaborations

Nomura collaborates with notable colleagues, including Kunihito Ide and Koji Mishima. Their combined expertise contributes to the innovative advancements in their field.

Conclusion

Kazufumi Nomura's contributions to electrolytic processing technology highlight his role as a leading inventor in Japan. His patents reflect a commitment to enhancing the efficiency and uniformity of plating methods.

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