Kazufumi Izumida

Title: Kazufumi Izumida: Innovator in Copper Foil Technology

Introduction

Kazufumi Izumida is a notable inventor based in Kuala Lumpur, Malaysia. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. With a total of 2 patents to his name, Izumida's work focuses on enhancing the performance and reliability of copper foils used in printed wiring boards.

Latest Patents

Izumida's latest patents include innovations in surface-treated copper foil. The objective of this invention is to provide a surface-treated copper foil that is free from chromium in the surface-treatment layer while exhibiting excellent peel strength and chemical resistance. This is achieved by forming a surface-treatment layer on a bonding surface of a copper foil, which is essential for manufacturing copper-clad laminates. The layer is created by depositing a metal component with a high melting point, not lower than 1400°C, using a dry process film formation method after cleaning treatment.

Another significant patent involves a copper foil with a carrier sheet. This invention allows for the easy release of the carrier sheet from the copper foil layer, even when subjected to hot pressing at temperatures exceeding 300°C. The copper foil is designed with a physically releasable carrier sheet, featuring a bonding interface layer composed of a metal layer and a carbon layer. The specifications for the bonding interface layer include a metal layer thickness of 1 nm to 50 nm and a carbon layer thickness of 1 nm to 20 nm.

Career Highlights

Kazufumi Izumida is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of materials science. His work has been instrumental in advancing the technology behind copper foils, which are critical components in electronic devices.

Collaborations

Izumida has collaborated with notable colleagues, including Seiji Nagatani and Hiroshi Watanabe, to further enhance the development of copper foil technologies. Their combined expertise has contributed to the successful implementation of innovative solutions in the industry.

Conclusion

Kazufumi Izumida's contributions to copper foil technology demonstrate his commitment to innovation and excellence in materials science. His patents reflect a deep understanding of the challenges in the field and provide effective solutions that enhance the performance of electronic components.