Mitsui Minings & Melting Co., Ltd.

Kazufumi Izumida

Seiji Nagatani

Hiroshi Watanabe

Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400&#xb0; C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.

Surface-treated copper foil

An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300&#xb0; C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.

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Kuala Lumpur, Malaysia

Kazufumi Izumida