Seattle, WA, United States of America

Kayla Fenton

This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kayla Fenton. Retrieved from https://idiyas.com/inventor/kayla-fenton

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Kayla Fenton: Innovator in Packaging Systems

Introduction

Kayla Fenton is a notable inventor based in Seattle, WA, who has made significant contributions to the field of packaging systems. With a focus on improving packaging efficiency, her work has the potential to streamline operations in various industries.

Latest Patents

Kayla holds one patent for a packaging recommendation system. This innovative system describes techniques for enhancing packaging processes. The computer system receives item data from a workstation, which includes a description of the item. Additionally, it receives fit parameters that adjust how items fit within packaging. Based on inputs to a packaging decision system, the computer generates a package decision that indicates the appropriate package type for the item. This decision is informed by historical item order data, allowing for more efficient packaging solutions.

Career Highlights

Kayla is currently employed at Amazon Technologies, Inc., where she applies her expertise in packaging systems. Her work contributes to the company's commitment to innovation and efficiency in logistics and supply chain management.

Collaborations

Some of her coworkers include David Joseph Gasperino and Renan Garcia, who collaborate with her on various projects within the company.

Conclusion

Kayla Fenton's innovative approach to packaging systems exemplifies the impact of technology on improving operational efficiency. Her contributions are paving the way for advancements in the packaging industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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