Penang, Malaysia

Kay Siang Sim


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Kay Siang Sim: Innovator in PCB Technology

Introduction

Kay Siang Sim is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative designs have paved the way for advancements in electronic devices.

Latest Patents

Kay Siang Sim holds a patent for a "Printed circuit board (PCB) connector interface module with heat and scratch resistant coverlay and accessory system." This invention includes a PCB connector interface module and an accessory system. The module consists of a first layer, a second layer, and multiple inner layers. The first layer features a set of contact pads designed to connect electrically to an accessory device, along with a heat and scratch resistant coverlay. The second layer contains another set of contact pads that connect to an internal PCB of an electronic apparatus. The inner layers include printed circuit boards and contact vias that facilitate electrical connections between the two sets of contact pads. This innovative design enhances the durability and functionality of electronic devices.

Career Highlights

Kay Siang Sim is currently employed at Motorola Solutions, Inc., where he continues to develop cutting-edge technologies. His work focuses on improving the efficiency and reliability of electronic components. His contributions have been instrumental in advancing the capabilities of modern electronic systems.

Collaborations

Throughout his career, Kay Siang Sim has collaborated with talented professionals, including Chun Wen Ooi and Jorge L Garcia. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Kay Siang Sim is a distinguished inventor whose work in PCB technology has made a lasting impact on the electronics industry. His innovative designs and collaborations continue to drive advancements in this vital field.

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