This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Kinetitec Corporation. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Kay Dean Bowles: Innovator in Friction Reduction Technology
Introduction
Kay Dean Bowles is a notable inventor based in Spokane, WA (US). He has made significant contributions to the field of friction reduction technology. His innovative approach has led to the development of a unique patent that addresses the challenges of wear and friction in various applications.
Latest Patents
Bowles holds a patent titled "Surface for reduced friction and wear and method of making the same." This patent describes a process for producing an enhanced friction-reducing surface by bonding a dry lubricant to a substrate through high-velocity mechanical impact and low-temperature diffusion bonding. The friction-reduced surface produced by this method is designed to improve performance and longevity in various applications. The process also includes bonding the dry lubricant by peening, which allows for the desired dimpling or surface texturizing through careful selection of peening particle size and hardness relative to the substrate, as well as the impact velocity against the substrate. Bowles has 1 patent to his name.
Career Highlights
Kay Dean Bowles is associated with Kinetitec Corporation, where he applies his expertise in friction reduction technologies. His work at the company has positioned him as a key player in the development of innovative solutions that enhance the performance of materials in demanding environments.
Collaborations
Bowles collaborates with talented individuals such as Jane E Buehler and Wade Bowles. Their combined efforts contribute to the advancement of technology in their field.
Conclusion
Kay Dean Bowles is a pioneering inventor whose work in friction reduction technology has the potential to impact various industries. His innovative patent and collaboration with skilled professionals highlight his commitment to advancing technology.