Eisenach, Germany

Kay Andreas

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Bizlink Industry Germany Gmbh. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kay Andreas. Retrieved from https://idiyas.com/inventor/kay-andreas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Kay Andreas - Innovator in Assembly Systems

Introduction

Kay Andreas is a notable inventor based in Eisenach, Germany. He has made significant contributions to the field of assembly systems, particularly with his innovative designs that enhance connectivity between elongated hollow bodies.

Latest Patents

Kay Andreas holds a patent for a coupling device designed for connecting elongated hollow bodies in an assembly system. This device features a first receiving opening for a first elongated hollow body and a second receiving opening for a second elongated hollow body. The arrangement of these openings allows for the effective coupling of the two bodies after they are introduced into their respective openings.

Career Highlights

Kay Andreas is associated with Bizlink Industry Germany GmbH, where he applies his expertise in developing advanced assembly solutions. His work has been instrumental in improving the efficiency and functionality of assembly systems.

Collaborations

Throughout his career, Kay has collaborated with talented individuals such as Bernd Joesten and Torsten Denk. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Kay Andreas is a distinguished inventor whose work in assembly systems has led to practical advancements in the industry. His patent for a coupling device exemplifies his commitment to innovation and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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