Laguna Hills, CA, United States of America

Kavous Vakilian

This inventor holds 3 USPTO granted patents. Top assignee: Viking Components. Active years: 2000-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kavous Vakilian. Retrieved from https://idiyas.com/inventor/kavous-vakilian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.2

ph-index = 3

Forward Citations = 197(Granted Patents)


Company Filing History:


Years Active: 2000-2001

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3 patents (USPTO):Explore Patents

Title: Kavous Vakilian: Innovator in Computer Module Technology

Introduction

Kavous Vakilian is a notable inventor based in Laguna Hills, California. He has made significant contributions to the field of computer technology, holding three patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is for a high-density computer module with stacked parallel-plane packaging. This module is designed for insertion into an expansion slot of a computer and includes a primary board along with a pair of auxiliary boards. The auxiliary boards are strategically mounted to create air paths that facilitate air circulation between the boards. Each auxiliary board features a trace for electrical connection to the primary board, ensuring efficient communication between the components. The design emphasizes the importance of trace length, with the traces of the auxiliary boards being substantially the same length, while the primary board's trace is only slightly longer.

Another significant patent by Kavous Vakilian is for a multi-chip package with stacked chips and interconnect bumps. This innovative package includes a substrate with an opening in the central region, where at least two integrated circuit chips are mounted. The first chip is connected to one side of the substrate, while the second chip is connected to the opposite side. This vertical stacking of chips allows for efficient use of space, and the substrate's bottom side features interconnect bumps that provide electrical connections to circuit boards or other substrates.

Career Highlights

Kavous Vakilian has established himself as a key player in the technology sector through his work at Viking Components. His expertise in developing advanced computer modules and multi-chip packages has positioned him as an influential inventor in the industry.

Collaborations

Kavous has collaborated with various professionals in his field, including his coworker Jayesh R Bhakta. Their combined efforts contribute to the innovative projects at Viking Components.

Conclusion

Kavous Vakilian's contributions to computer technology through his patents reflect his dedication to innovation and excellence. His work continues to influence the development of advanced computing solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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