Company Filing History:
Years Active: 2001
Title: Kau-Jan Wang: Innovator in Integrated Circuit Technology
Introduction
Kau-Jan Wang is a notable inventor based in Chia-I, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly in the area of fuse access openings for laser trimming. His innovative approach has led to advancements in the control of dielectric thickness over fuses, which is crucial for the reliability and performance of integrated circuits.
Latest Patents
Kau-Jan Wang holds a patent titled "Process for controlling oxide thickness over a fusible link using transient etch stops." This patent describes a method for progressively forming a fuse access opening in an integrated circuit while ensuring improved control of dielectric thickness over the fuse. The process involves the formation of a dielectric layer over the fuse, followed by the patterning of a polysilicon layer to create a first etch stop. An interlayer dielectric (ILD) layer is then added, and a second etch stop is formed in a first metal layer on the ILD layer. This innovative method protects the ILD layer during etching processes, maintaining a controlled and uniform thickness of the dielectric material over the fuse.
Career Highlights
Kau-Jan Wang is currently employed at Vanguard International Semiconductor Corporation, where he continues to develop cutting-edge technologies in semiconductor manufacturing. His work has been instrumental in enhancing the efficiency and effectiveness of integrated circuit designs.
Collaborations
Kau-Jan Wang has collaborated with several talented individuals in his field, including Wen-Tsing Tzeng and Yue-Feng Chen. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Kau-Jan Wang's contributions to integrated circuit technology exemplify the importance of innovation in the semiconductor industry. His patented processes not only improve the performance of integrated circuits but also pave the way for future advancements in the field.