Company Filing History:
1 out of 30 
1 out of 1 
2 out of 832,966 Years Active: 1999-2002
Title: Katsuro Aoshima: Innovator in Circuit Board Technology
Introduction
Katsuro Aoshima is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and density of semiconductor component packaging.
Latest Patents
Aoshima's latest patents include a circuit board and a manufacturing method for it, as well as a bump-type contact head and semiconductor component packaging module utilizing the circuit board. This innovative circuit board features bump patterns with minimal height variation on its surface, allowing for high-density packaging of semiconductor components. The design incorporates conductor circuits formed by electroplating, which are embedded in an insulating base made of a resist layer and an insulating substrate. The bumps are exposed on the surface of the insulating base, and they connect electrically to the conductor circuits through pillar-shaped conductors formed by electroplating. Each bump is a multilayer structure created by successively depositing different electrically conductive materials.
Career Highlights
Throughout his career, Aoshima has worked with various companies, including Meiko Electronics Co., Ltd. His expertise in circuit board technology has positioned him as a key player in the industry.
Collaborations
Aoshima has collaborated with notable professionals such as Noboru Shingai and Tatsuo Wada, contributing to advancements in circuit board design and manufacturing.
Conclusion
Katsuro Aoshima's innovative work in circuit board technology has led to significant advancements in semiconductor packaging. His patents reflect a commitment to enhancing the efficiency and functionality of electronic components.