Kyoto, Japan

Katsumi Noda

This inventor holds 1 USPTO granted patent. Top assignees: Nissei Asb Machine Co., Ltd., Toppan Printing Co., Ltd., Yusin Precision Equipment Co.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsumi Noda. Retrieved from https://idiyas.com/inventor/katsumi-noda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1991

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Katsumi Noda

Introduction

Katsumi Noda is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of engineering, particularly in the development of machinery for manufacturing processes. His innovative spirit and technical expertise have led to the creation of a unique patent that showcases his skills.

Latest Patents

Katsumi Noda holds a patent for a molding machine designed for an oriented and blown hollow container with a label. This invention reflects his commitment to improving manufacturing efficiency and product quality in the packaging industry.

Career Highlights

Throughout his career, Noda has worked with prominent companies such as Toppan Printing Co., Ltd. and Nissei Asb Machine Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various projects that enhance production techniques.

Collaborations

Noda has collaborated with talented individuals in his field, including coworkers Tatsuo Furuse and Keiji Kazato. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Katsumi Noda's contributions to the field of engineering and his innovative patent demonstrate his dedication to advancing manufacturing technology. His work continues to inspire future inventors and engineers in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…