Osaka, Japan

Katsumi Koda

This inventor holds 1 USPTO granted patent. Top assignee: Toho Kinzoku Co., Ltd.. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsumi Koda. Retrieved from https://idiyas.com/inventor/katsumi-koda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Katsumi Koda: Innovator in Copper-Tungsten Alloys

Introduction

Katsumi Koda is a notable inventor based in Osaka, Japan, with a focus on the development of innovative materials. His dedication to research and invention has contributed to advancements in metal alloys, specifically in the realm of copper-tungsten alloys.

Latest Patents

Koda holds one patent, which revolves around copper-tungsten alloys and their manufacturing methods. This invention is significant in various industrial applications where the combination of these materials enhances thermal and electrical conductivity.

Career Highlights

Currently, Katsumi Koda is employed at Toho Kinzoku Co., Ltd., a company known for its work with advanced materials. His career reflects a strong commitment to innovation and the exploration of practical solutions in metallurgy.

Collaborations

Throughout his career, Koda has collaborated with noteworthy colleagues, including Naoyoshi Akiyoshi and Kimio Nakada. These collaborations have undoubtedly enriched his work and fostered a creative environment for innovation.

Conclusion

In conclusion, Katsumi Koda stands out as an inventor whose contributions to copper-tungsten alloys demonstrate a commitment to improving materials used in technology and manufacturing. His work at Toho Kinzoku Co., Ltd. and collaborative efforts with other professionals showcase the importance of teamwork in the pursuit of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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