This inventor holds 2 USPTO granted patents. Top assignee: Smc Corporation. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Innovations of Katsumi Iijima
Introduction
Katsumi Iijima is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of thermoplastic resin technologies. With a total of 2 patents, Iijima's work focuses on innovative methods that enhance the capabilities of thermoplastic materials.
Latest Patents
Iijima's latest patents include an "Even pressure welding method by using fluid pressure." This method involves vacuum-packing joined members made of thermoplastic resin, which have a fluid flow path formed of a groove and/or a hole in a junction face. The wrapped body is heated to soften the joined members, allowing them to be welded together through the application of fluid pressure. This process ensures even pressurization from the periphery, followed by cooling to solidify the weld. Another significant patent is the "Method for embedding part in base made of thermoplastic resin." In this method, an embedding hole is formed in a thermoplastic resin base, and an embedded part is inserted. The base undergoes heating treatment to soften it, followed by restraining treatment to control outward thermal expansion, allowing the base to conform closely to the embedded part.
Career Highlights
Katsumi Iijima is currently associated with SMC Corporation, where he continues to innovate in the field of thermoplastic materials. His work has been instrumental in advancing the applications of these materials in various industries.
Collaborations
Iijima has collaborated with notable coworkers, including Koji Wada and Yutaka Yoshida. Their combined expertise has contributed to the successful development of innovative technologies in their field.
Conclusion
Katsumi Iijima's contributions to thermoplastic resin technologies through his patents demonstrate his commitment to innovation. His work continues to influence the industry and pave the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
