Nagaokakyo, Japan

Katsuma Moroishi

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2017-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsuma Moroishi. Retrieved from https://idiyas.com/inventor/katsuma-moroishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2017-2018

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2 patents (USPTO):Explore Patents

Title: Katsuma Moroishi - Innovator in Electronic Component Manufacturing

Introduction

Katsuma Moroishi is an inventor based in Nagaokakyo-shi, Japan. He has made contributions to the field of electronic components, focusing on innovative manufacturing methods. Although he currently holds no granted patents, his work is noteworthy for its potential impact on the industry.

Latest Patent Applications

Moroishi's latest patent application is titled "ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME." This application describes a method of manufacturing an electronic component that includes bonding a dome-shaped cap with a recess to a substrate. The substrate is equipped with a vibrator and a bonding material that projects in a rounded shape, surrounding the vibrator. The cap is positioned so that the open side of the recess faces the substrate and is pressed against it. The bonding material is arranged such that, relative to the vibrator, the outer side end portion of the cap is located on the inner side of the bonding material, or the inner side end portion of the cap is on the outer side of the bonding material.

Conclusion

Katsuma Moroishi's innovative approach to electronic component manufacturing showcases his dedication to advancing technology in this field. His patent application reflects a unique method that could influence future developments in electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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