Company Filing History:
Years Active: 1998-2021
Title: Katsuhiro Tsuno: Innovator in Thermal Transport Technologies
Introduction
Katsuhiro Tsuno, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of thermal transport systems. With a portfolio of seven patents, Tsuno's innovations focus on enhancing the efficiency of thermal management processes in transportation devices.
Latest Patents
Among his notable inventions is a **Transport Device**, designed to facilitate effective thermal storage temperature control for thermal storage materials during transportation. This device features a thermally insulated cylindrical container, a temperature control unit that can be detachably fitted onto the container, and a heat transferring body for conducting temperature management. The invention also includes a storage space within the heat-transferring body, allowing for easy insertion and removal of stored objects.
Another recent invention is the **Transport Container**, which comprises a first container with a vacuum space for insulating a transported object and a heat-insulating lid for sealing. This container is designed to surround the transported object with a heat storage material, ensuring optimal thermal conditions during transport.
Career Highlights
Throughout his career, Tsuno has been associated with esteemed organizations such as Fujifilm Toyama Chemical Co., Ltd., and Technova Inc. His role at the Engineering Advancement Association of Japan further underscores his commitment to advancing technology in thermal storage and transport systems.
Collaborations
Katsuhiro Tsuno has collaborated with many talented professionals, including associates like Hideo Watanabe and Tsuyoshi Tosho. These partnerships have fostered an environment of creativity and innovation, contributing to the development of impactful technologies.
Conclusion
Katsuhiro Tsuno continues to be an influential figure in the realm of thermal transport innovations. His patents not only reflect his inventiveness but also demonstrate a significant advance in thermal management technologies, contributing to improved efficiency in various applications.