This inventor holds 1 USPTO granted patent. Top assignee: Rengo Co., Ltd.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Katsuhiko Yasumoto: Innovator in Corrugated Paperboard Technology
Introduction
Katsuhiko Yasumoto is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of packaging technology, particularly in the design and functionality of corrugated paperboard boxes. His innovative approach has led to the development of a unique method that enhances the usability of these boxes.
Latest Patents
Yasumoto holds a patent for a corrugated paperboard box, which includes a perforation forming method and device. This invention addresses the common issue of perforated lines breaking when flaps are bent. The design features a peripheral wall and top flaps, with a groove-shaped reverse scoreline and parallel groove-shaped recesses that improve the integrity of the perforated line. This allows the top flaps to be bent along the perforated line without compromising the box's structure.
Career Highlights
Yasumoto's career is marked by his dedication to improving packaging solutions. His work at Rengo Co., Ltd. has positioned him as a key player in the industry. His innovative designs not only enhance the functionality of packaging but also contribute to sustainability efforts by optimizing material usage.
Collaborations
Throughout his career, Yasumoto has collaborated with talented individuals such as Taku Furuta and Masayoshi Ootani. These partnerships have fostered a creative environment that encourages the development of groundbreaking packaging technologies.
Conclusion
Katsuhiko Yasumoto's contributions to corrugated paperboard technology exemplify the impact of innovation in packaging. His patented designs not only improve usability but also set new standards in the industry. His work continues to inspire advancements in packaging solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile