Tokyo, Japan

Katsuhiko Gunji


 

Average Co-Inventor Count = 4.5

ph-index = 10

Forward Citations = 255(Granted Patents)


Company Filing History:


Years Active: 1990-2006

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17 patents (USPTO):Explore Patents

Title: **Katsuhiko Gunji: Innovator in Integrated Circuit Manufacturing**

Introduction

Katsuhiko Gunji, an accomplished inventor based in Tokyo, Japan, is known for his significant contributions to the field of integrated circuit devices and packaging substrates. With a remarkable collection of 17 patents, Gunji's work showcases the intersection of innovation and practical applications in technology.

Latest Patents

Among his latest creations, Gunji has developed a packaging substrate and a manufacturing method that enhances the junction strength of integrated circuit elements when mounted by a flip-chip method. Another notable patent involves a duplexer that contains both transmission and reception filters using thin-film piezoelectric resonators. These resonators are designed with piezoelectric thin films and double excitation electrodes, allowing for efficient signal processing in electronic devices.

Career Highlights

Katsuhiko Gunji has had a dynamic career, working with prominent companies such as Oki Electric Industry Co., Ltd. and TDK Corporation. His experience in these organizations has undoubtedly played a critical role in shaping his innovative approaches and technical expertise within the field of electronics.

Collaborations

Throughout his career, Gunji has collaborated with esteemed colleagues including Tomokazu Komazaki and Norio Onishi. Their joint efforts have contributed to advancements in technology and have led to the successful implementation of numerous patents that push the boundaries of existing methods and devices.

Conclusion

Katsuhiko Gunji stands as a testament to the spirit of innovation within the electronics industry. His extensive patent portfolio and collaborative efforts underline his commitment to advancing technology, ensuring that his contributions will have a lasting impact on future developments in integrated circuit manufacturing and packaging technologies.

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