The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Jan. 18, 2006
Masahiro Nakano, Tokyo, JP;
Katsuhiko Gunji, Tokyo, JP;
Yasunobu Oikawa, Tokyo, JP;
Katsuo Sato, Tokyo, JP;
Masahiro Nakano, Tokyo, JP;
Katsuhiko Gunji, Tokyo, JP;
Yasunobu Oikawa, Tokyo, JP;
Katsuo Sato, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A basic portion layerof a substrate electrodeconnected to a projecting electrodeelectrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layeris formed is subjected to sintering. A surface of the basic portion layerin the sintered substrate member is polished. On the polished basic portion layer, the plating layersare formed, so that surface roughness of the substrate electrodemay be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.