Hyogo, Japan

Katsufumi Shimanaka



Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2013-2016

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2 patents (USPTO):Explore Patents

Title: Katsufumi Shimanaka: Innovator in Heat Conductive Materials

Introduction

Katsufumi Shimanaka is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of materials science, particularly in the development of heat conductive compositions and sealing members for capacitors. With a total of 2 patents, his work showcases innovative solutions to enhance thermal management in electronic devices.

Latest Patents

Shimanaka's latest patents include an anisotropic heat conductive composition and a sealing member for capacitors. The anisotropic heat conductive composition comprises flake graphite particles and a resin composition, designed to create efficient heat conductive paths when formed into sheets. This invention allows for effective heat dispersion from high temperature regions to low temperature regions. The second patent, a cylindrical sealing member for capacitors, features a unique design that incorporates butyl rubber and inorganic material oblate particles. This design ensures optimal orientation of the particles to enhance the sealing performance of the capacitor.

Career Highlights

Throughout his career, Katsufumi Shimanaka has worked with prominent companies such as Panasonic Corporation and Panasonic Intellectual Property Management Co., Ltd. His experience in these organizations has allowed him to refine his expertise in materials innovation and patent development.

Collaborations

Shimanaka has collaborated with notable colleagues, including Kiyoshi Hirota and Yuichiro Tsubaki. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Katsufumi Shimanaka's contributions to the field of heat conductive materials and capacitor technology highlight his innovative spirit and dedication to advancing electronic components. His patents reflect a commitment to improving thermal management solutions in modern technology.

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