Kashi V Machani

Title: Kashi V Machani: Innovator in Chip Module Technology

Introduction

Kashi V Machani is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of chip module technology, particularly through his innovative patent that enhances the reliability of chip interconnects.

Latest Patents

Kashi V Machani holds a patent for a "Chip module with robust in-package interconnects." This invention discloses various chip module structures that incorporate robust in-package interconnects to ensure reliable performance. The patent details methods for achieving interconnect robustness, including the use of vias arranged in a spiral step pattern within the interconnect. Additionally, some structures utilize an interconnect stabilizer, which features vias in a repeating step pattern that encircle the in-package interconnect. This stabilizer is electrically isolated from back side solder balls and front side collapse chip connections, and it can be optionally connected to ground. The combination of these techniques contributes to the overall reliability of the chip module.

Career Highlights

Kashi V Machani is currently employed at GlobalFoundries U.S. Inc., where he continues to work on advancing chip technology. His expertise in the field has positioned him as a valuable asset to the company and the industry at large.

Collaborations

Throughout his career, Kashi has collaborated with notable colleagues, including Saquib B Halim and Frank G Kuechenmeister. These collaborations have further enriched his work and contributed to the development of innovative technologies in chip modules.

Conclusion

Kashi V Machani's contributions to chip module technology through his patent demonstrate his commitment to innovation and reliability in electronic components. His work continues to influence the industry and pave the way for future advancements.